Sensor Integration Services
At Wellinq, we develop and produce sub-assemblies with our own sensors as well as 3rd party sensors. We have numerous years of experience and specific know-how to die attach, wire bond, encapsulate, steer and compensate the sensor, and provide R&D engineering projects for this. In these projects we design the sensor sub-assembly for the products of our partners; of course always in close cooperation with the partners. This comprises requirement analysis, feasibility analysis, technical drawings as well as prototyping. After an engineering project has been finalized, we can also provide the manufacturing of the sensor sub-assemblies.
One of our own sensors is the advanced miniature piezo resistive pressure sensor, created using Sentron’s proprietary full Wheatstone bridge for differential pressure measurements. Thanks to this differential pressure measurement there is no influence due to atmospheric changes. The sensor is stable with low drift in varying pressure and temperature environments.
An OEM pressure sensor module typically consists of sub-assemblies containing the pressure sensor, housing parts and control electronics. The narrow dimensions and the high quality of this pressure sensor make it ideally suited for medical applications in fields such as cardiology, neurology and urology. Examples of applications for which we designed the sensor sub-assemblies are: ventricular pressure-volume measurements for optimization of pacemaker electrode placement, cranial pressure measurement, flow measurement for the world’s smallest heart pump, pressure measurement in urology and gastro-enterology catheters, and in-vivo blood pressure monitoring.